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COOLING SYSTEM FOR AN ENCLOSURE FOR HEAT SENSITIVE COMPONENTS AND METHOD

机译:用于热敏组件外壳的冷却系统和方法

摘要

A cooling system for a computer enclosure having no pre-cooling unit, the cooling system including a thermoelectric cooler unit mounted adjacent the computer enclosure, the thermoelectric cooler unit including at least one thermoelectric cooler module coupled on one side to a hot side heat sink and on another side to a cold side heat sink via a heat transfer element, for active cooling of the enclosure, and a method for cooling a computer enclosure, the method including mounting the computer enclosure adjacent a thermoelectric cooler module unit, the thermoelectric cooler unit including at least one thermoelectric cooler module coupled on one side to a hot side heat sink and on another side to a cold side heat sink via a heat transfer element.
机译:用于不具有预冷却单元的计算机机壳的冷却系统,该冷却系统包括邻近计算机机壳安装的热电冷却器单元,该热电冷却器单元包括至少一侧耦合到热侧散热器的热电冷却器模块,以及经由传热元件在另一侧上到达冷侧散热器,用于主动地冷却外壳,以及冷却计算机外壳的方法,该方法包括将计算机外壳安装在热电冷却器模块单元附近,该热电冷却器单元包括至少一个热电冷却器模块在一侧通过传热元件与热侧散热器相连,在另一侧与冷侧散热器相连。

著录项

  • 公开/公告号IL135017D0

    专利类型

  • 公开/公告日2001-05-20

    原文格式PDF

  • 申请/专利权人 ACTIVE COOL LTD.;

    申请/专利号IL20000135017

  • 发明设计人

    申请日2000-03-12

  • 分类号7G12BA;

  • 国家 IL

  • 入库时间 2022-08-22 01:24:53

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