Packaging material for electronic components, comprises stacked dishes with top and bottom surfaces defining elongated storage cavities

摘要

The packaging comprises a stack of dishes (1), each of which has a bottom surface with a shape defining the top half of elongated cavities (7), and a top surface with a shape defining the bottom half of these cavities. The components are kept in two or more parallel elongated cavities. An Independent claim is also included for a method of filling the packaging.