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LARGE ANGLE TILT IMPLANT (LATI) METHOD FOR FORMING A LIGHTLY DOPED DRAIN (LDD)

机译:大倾角倾斜法(LATI)形成轻掺杂排水(LDD)的方法

摘要

LARGE ANGLE TILT IMPLANT (LATI) METHOD FOR FORMING A LIGHTLY DOPED DRAIN (LDD) A method for forming within a Metal Oxide Semiconductor Field Effect Transistor(MOSFET) a Lightly Doped Drain (LDD) low dose ion implant structure which partially overlapsa source/drain electrode high dose ion implant structure. To form the Lightly Doped Drain (LDD)low dose ion implant structure there is formed upon a semiconductor substrate a gate dielectric layerhaving formed thereupon a gate electrode. Formed then upon the exposed portions of thesemiconductor substrate, the gate dielectric layer and the gate electrode is an insulator layer. Finally;there is implanted through a Large Angle Tilt Implant (LATI) method a minimum of one low doseion implant through the insulator layer and into the semiconductor substrate to form the LightlyDoped Drain (LDD) low dose ion implant structure within the semiconductor substrate. The LightlyDoped Drain (LDD) low dose ion implant structure includes a portion of the semiconductor substratebeneath the gate electrode edges. As an extension of the method, there may additionally be implantedin-situ substantially orthogonally to the semiconductor substrate a minimum of one high dose ionimplant through the insulator layer and into the semiconductor substrate. The high dose ion implantis employed in forming a source/drain electrode high dose ion implant structure adjoining but notbeneath the gate electrode edges. As a further extension of the method, there may be formed apolysilicon layer upon the insulator layer. The polysilicon layer, if present, and/or the insulator layermay optionally be anisotropically etched to form a polysilicon spacer and/or an insulator spacer. Byforming the polysilicon layer prior to the low dose ion implant or the high dose ion implant, there isformed a low dose ion implant structure or a high dose ion implant structure with a shallower junctionwhich assists in reducing short channel effects.(FIGURE 2 IS SUGGESTED FOR PUBLICATION)
机译:大倾角倾斜法(LATI)形成轻掺杂排水(LDD)的方法 在金属氧化物半导体场效应晶体管内形成的方法(MOSFET)部分重叠的轻掺杂漏极(LDD)低剂量离子注入结构源极/漏极高剂量离子注入结构。形成轻掺杂漏极(LDD)低剂量离子注入结构,在半导体衬底上形成栅极介电层在其上形成栅电极。然后形成在半导体衬底,栅介质层和栅电极是绝缘体层。最后;通过大角度倾斜植入物(LATI)植入至少一种低剂量离子注入穿过绝缘层并进入半导体衬底以形成轻半导体衬底内的掺杂漏(LDD)低剂量离子注入结构。轻轻地掺杂漏极(LDD)低剂量离子注入结构包括半导体衬底的一部分在栅电极边缘下方。作为该方法的扩展,可以另外植入基本垂直于半导体衬底的原位至少一种高剂量离子通过绝缘层注入并注入到半导体衬底中。高剂量离子植入用于形成邻接但不邻接的源/漏电极高剂量离子注入结构在栅电极边缘下方。作为该方法的进一步扩展,可以形成一个绝缘层上的多晶硅层。多晶硅层(如果存在)和/或绝缘层可以可选地各向异性地蚀刻可以形成多晶硅隔离物和/或绝缘隔离物的隔离物。通过在低剂量离子注入或高剂量离子注入之前形成多晶硅层,存在形成了具有较浅结的低剂量离子注入结构或高剂量离子注入结构这有助于减少短通道效应。(建议图2出版)

著录项

  • 公开/公告号SG78268A1

    专利类型

  • 公开/公告日2001-02-20

    原文格式PDF

  • 申请/专利权人 CHARTERED SEMICONDUCTOR MANUFACTURING LTD;

    申请/专利号SG19970001160

  • 发明设计人 YANG PAN;

    申请日1997-04-10

  • 分类号H01L21/265;H01L21/8238;

  • 国家 SG

  • 入库时间 2022-08-22 01:23:32

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