The present invention also provides a method of cost savings feedback in aprinted circuit board value chain that includes a yarn manufacturer whichmanufactures fiber glass yarn, a weaver which forms the fiber glass yarn intoa fabric, a laminator which forms the fabric into laminate and a printedcircuit board (PCB) manufacturer which forms the laminate into a PCB which thePCB manufacturer sells to an OEM customer, the method comprising the steps of(a) having a controlling entity; (b) transferring to the controlling entity atleast partial control of fiber glass yarn manufactured by a yarn manufacturer;(c) causing the fiber glass yarn to be delivered to a weaver for weaving intofabric; (d) transferring to the controlling entity at least partial control offabric formed by the weaver; (e) causing the fabric to be delivered to alaminator for laminating; (f) transferring to the controlling entity at leastpartial control of laminate formed by the laminator; (g) selling the laminateto a PCB manufacturer at a market price for other laminate formed from otherfiber glass yarn; (h) causing the laminate to be delivered to the PCBmanufacturer; (i) determining cost savings realized by the PCB manufacturer inresponse to forming PCBs utilizing the laminate versus utilizing the otherlaminate formed from the other fiber glass yarn; and (j) allocating at least aportion of the cost savings to the controlling entity.
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