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METHOD FOR APPLYING CONNECTING MATERIALS FOR CONNECTING A MICROCHIP AND A SUBSTRATE AND UTILIZATION OF A PRINTING HEAD WORKING ACCORDING TO THE INK PRINTING PRINCIPLE
METHOD FOR APPLYING CONNECTING MATERIALS FOR CONNECTING A MICROCHIP AND A SUBSTRATE AND UTILIZATION OF A PRINTING HEAD WORKING ACCORDING TO THE INK PRINTING PRINCIPLE
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机译:用于连接微芯片和基板的连接材料的方法以及根据墨水打印原理的打印头的利用
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摘要
The invention relates to a method for applying connecting materials for a connection between a microchip and a substrate, whereby an electrically conductive material is used to establish the electrical connection and a filling material is applied on the microchip and/or substrate for the mechanical connection between the substrate and the microchip. According to the invention, the electrically conductive material (3) and/or the filling material (5) are sprayed successively or simultaneously on the substrate (6) and/or the microchip (1) using at least one printing head (9) working according to the ink printing principle.
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