A method for the application of jointing materials for a connection between a microchip and a substrate, a method for producing an electrical and mechanical connection between a microchip and a substrate as well as the use of a according to the inks pressure principle operating print head

摘要

The invention relates to a method for applying connecting materials for a connection between a microchip and a substrate, whereby an electrically conductive material is used to establish the electrical connection and a filling material is applied on the microchip and/or substrate for the mechanical connection between the substrate and the microchip. According to the invention, the electrically conductive material (3) and/or the filling material (5) are sprayed successively or simultaneously on the substrate (6) and/or the microchip (1) using at least one printing head (9) working according to the ink printing principle.