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Method of manufacturing Si-Al alloys for electronic packaging
Method of manufacturing Si-Al alloys for electronic packaging
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机译:电子封装用硅铝合金的制造方法
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摘要
A method of producing a silicon based alloy is described which comprises melting a silicon alloy containing greater than 50 wt.% silicon and preferably including aluminium. The melted alloy is then inert gas atomized to produce powder or a spray formed deposit in which the silicon forms a substantially continuous phase made up of fine, randomly oriented crystals in the microstructure. The alloy produced by the method has particularly useful application in electronics packaging materials and a typical example comprises an alloy of 70 wt.% silicon and 30 wt.% aluminium. Such an alloy is an engineering material which, for example, is machinable.
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