首页> 外国专利> AN ELECTRON-BEAM EXPOSURE SYSTEM A MASK FOR ELECTRON-BEAM EXPOSURE AND A METHOD FOR ELECTRON-BEAM EXPOSURE

AN ELECTRON-BEAM EXPOSURE SYSTEM A MASK FOR ELECTRON-BEAM EXPOSURE AND A METHOD FOR ELECTRON-BEAM EXPOSURE

机译:电子束曝光系统,电子束曝光掩模和电子束曝光方法

摘要

The present invention provides an electron beam exposure process and an electron beam exposure system wherein the electron beam exposure system includes a scattering angle limiter with a mask including a limiting aperture that limits the amount of scattered electrons passing through the scattering area and the mask, Type electron beam exposure system comprising: a first limiting aperture secured around a crossover surface and having a central aperture and a closed elongated aperture surrounding the central aperture; And a second limiting aperture having a central opening and a closed elongated opening surrounding the central opening. The present invention also provides a stencil-like mask suitable for an exposure system and an exposure process. According to the present invention, it is possible to adjust the proximity effect correction so that the accuracy of the line width is excellent without reducing the throughput in the patterning step of the process of manufacturing the semiconductor device in particular. The mask according to the present invention can be provided with an accurate mask pattern so that an accurate mask pattern can be provided in which pattern exposure with good resolution and accuracy can be performed.
机译:本发明提供了一种电子束曝光方法和电子束曝光系统,其中该电子束曝光系统包括具有掩模的散射角限制器,该掩模具有限制孔径,该孔径限制了通过散射区域和掩模的散射电子的数量。电子束曝光系统,包括:第一限制孔,其固定在交叉表面周围并具有中心孔和围绕该中心孔的封闭的细长孔;以及第二限制孔具有中心开口和围绕该中心开口的封闭的细长开口。本发明还提供适用于曝光系统和曝光工艺的模版样掩模。根据本发明,可以在不降低特别是在制造半导体器件的过程的图案化步骤中的生产量的情况下,调整接近效应校正,以使得线宽的精度优异。根据本发明的掩模可以设置有精确的掩模图案,从而可以提供其中可以执行具有良好的分辨率和精度的图案曝光的精确的掩模图案。

著录项

  • 公开/公告号KR20000076714A

    专利类型

  • 公开/公告日2000-12-26

    原文格式PDF

  • 申请/专利权人 카네코 히사시;

    申请/专利号KR20000008732

  • 发明设计人 야마시타히로시;

    申请日2000-02-23

  • 分类号G03F7/20;

  • 国家 KR

  • 入库时间 2022-08-22 01:14:29

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