首页> 外国专利> THERMOSETTING POLYPHENYLENE ETHER RESIN COMPOSITION CURED RESIN COMPOSITION OBTAINED THEREFROM AND LAMINATED STRUCTURE

THERMOSETTING POLYPHENYLENE ETHER RESIN COMPOSITION CURED RESIN COMPOSITION OBTAINED THEREFROM AND LAMINATED STRUCTURE

机译:由其获得的热固性聚乙烯醚树脂组成的固化树脂组合物和层状结构

摘要

(A) PPE and (b) 3,4- dihydro-3-substituted-1, 3-benzoxazol-curable polyester comprises a mixture of the compound having a photo skeleton or ring-opening polymer (phenylene ether) (PPE) resin composition. Cured PPE composition obtained by curing the composition of PPE; PPE and the curable composition or the cured PPE multilayer structure using the resin composition. The curable PPE compositions of the present invention chemical resistance excellent after curing, moisture resistance, dielectric characteristics, heat resistance, flame retardance, because it represents the dimensional stability, electrical / electronic industry, space / aircraft dielectric material in the field of industry, such as insulating materials, heat-resistant a material such as glass may be used. In particular, the curable single-sided printed circuit board, double-sided printed circuit board, multilayer printed circuit board, a flexible printed substrate, a semi-rigid substrate and the heat dissipation properties can be used advantageously as the resin composition for forming an insulating layer such as an excellent substrate.
机译:(A)PPE和(b)3,4-二氢-3-取代-1,3-苯并恶唑可固化聚酯包括具有光骨架化合物或开环聚合物(苯醚)(PPE)树脂组合物的混合物。固化的PPE组合物,通过固化所述PPE组合物得到; PPE和使用树脂组合物的可固化组合物或固化的PPE多层结构。本发明的可固化的PPE组合物在固化后具有优异的耐化学性,耐湿性,介电特性,耐热性,阻燃性,因为它代表了尺寸稳定性,在电气/电子工业,航天/飞机介电材料等工业领域中,诸如作为绝缘材料,可以使用诸如玻璃的耐热材料。特别地,可固化的单面印刷电路板,双面印刷电路板,多层印刷电路板,柔性印刷基板,半刚性基板和散热性可以有利地用作用于形成绝缘层的树脂组合物。绝缘层,例如优良的基材。

著录项

  • 公开/公告号KR20010034243A

    专利类型

  • 公开/公告日2001-04-25

    原文格式PDF

  • 申请/专利权人 야마모토 카즈모토;

    申请/专利号KR20007007918

  • 发明设计人 가또아끼히로;기노시따쇼조;

    申请日2000-07-20

  • 分类号C08L71/12;

  • 国家 KR

  • 入库时间 2022-08-22 01:13:49

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