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Heatsink and semiconductor laser device and semiconductor laser stack using heatsink

机译:散热器和半导体激光器装置以及使用散热器的半导体激光器堆

摘要

The semiconductor laser stacking apparatus 1 includes three semiconductor lasers 2a to 3c, two copper plates 3a and 3b, two lid plates 4a and 4b, a supply pipe 5, a discharge pipe 6, Insulating members 7a to 7d, and three heat sinks 10a to 10c. The heat sinks 10a to 10c include a lower flat plate member 12 having a supply channel recess 22 formed on its upper surface, an intermediate flat plate member 14 having a plurality of diaphragm holes 38 formed therein, And an upper flat plate member 16 on which the channel groove 30 is formed are sequentially laminated, and the contact surfaces are joined together.
机译:半导体激光器堆叠装置1包括三个半导体激光器2a至3c,两个铜板3a和3b,两个盖板4a和4b,供给管5,排出管6,绝缘构件7a至7d以及三个散热器10a至10b。 10分。散热器10a至10c包括在其上表面上形成有供应通道凹部22的下平板构件12,在其中形成有多个隔膜孔38的中间平板构件14以及在其上的上平板构件16。依次形成通道槽30,并将接触面接合在一起。

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