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Method for encapsulating COB packages on wiring carriers with very small pitch spacings involves vibrating package when applying encapsulation material
Method for encapsulating COB packages on wiring carriers with very small pitch spacings involves vibrating package when applying encapsulation material
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机译:将COB封装封装在间距很小的布线载体上的方法包括在应用封装材料时振动封装
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摘要
The method involves first applying the encapsulation material from the outside towards the inside in the vicinity of the wire. The package is then vibrated mechanically, after which the surface of the package is encapsulated by positioned application of the encapsulation material
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