Process for producing encapsulated chips, involves separates chipping with contacts from a wafer and spray coating to encapsulate and applying wiring structure

摘要

A process for producing encapsulated chips comprises producing a wafer (100) with surface contacts (104), arranging it on a separating substrate (106) and dividing into chips (102) through grooves, spray coating an encapsulating material between contacts and grooves and forming a wiring structure through the encapsulation.