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Polishing cloth for semiconductor substrate discs has upper and lower layers provided with segments spaced via separation channels and intermediate porous layer for uniform distribution of polishing medium
Polishing cloth for semiconductor substrate discs has upper and lower layers provided with segments spaced via separation channels and intermediate porous layer for uniform distribution of polishing medium
The polishing cloth (8) is supplied with a liquid or a colloid dispersion polishing medium from the rear side of a polishing plate and has a layer structure with an intermediate porous layer (3) between upper and lower segmented layers. The segments of the upper and lower layers are spaced from one another via separation channels (2,5), for providing a channel network cooperating with the pores (7) of the intermediate layer for distribution of the polishing medium.
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