首页>
外国专利>
Manufacturing electronic semiconducting components involves attaching semiconducting body to conductive substrate, making electrical connections, encapsulating body, dividing substrate
Manufacturing electronic semiconducting components involves attaching semiconducting body to conductive substrate, making electrical connections, encapsulating body, dividing substrate
展开▼
机译:制造电子半导体元件包括将半导体本体附着到导电基板,进行电连接,封装主体,分隔基板
展开▼
页面导航
摘要
著录项
相似文献
摘要
The method involves providing a conductive substrate (1), attaching a semiconducting body (2) to a first surface side of the substrate, making electrical connections (3.1,3.2) from the body to the first surface side, making a housing body (4) by encapsulating the semiconducting body and connections with insulating material and making mutually electrically insulated connection surfaces (5.1,5.2) by dividing the substrate from a second side. Independent claims are also included for the following: the use of the method for manufacturing light emitting semiconducting components and the use of the method for manufacturing active and passive semiconducting components.
展开▼