首页> 外国专利> Visual quality checking device for solder joints in ball grid array of surface-mount device, has endoscope in stabilizing sheath bent through up to 90 degrees

Visual quality checking device for solder joints in ball grid array of surface-mount device, has endoscope in stabilizing sheath bent through up to 90 degrees

机译:表面安装装置的球栅阵列中焊点的视觉质量检查装置,内窥镜可稳定护套弯曲多达90度

摘要

An endoscope (7) has a stabilising sheath (9), an objective lens positionable w.r.t. the solder joint to be tested, and an independently positionable light source. The stabilizing sheath is bent (11) through an angle in the range 45 to 90 degrees immediately in front of its distal end on the objective lens side. The sheath is aligned so that the axis of the light guide (8) in the lens region lies in the x-y plane, and the axis of the light guide lies on the z-axis or on an axis in the y-z plane that deviates by up to 45 degrees from this.
机译:内窥镜(7)具有稳定护套(9),其物镜可W.r.t.待测试的焊点和可独立定位的光源。稳定护套在其物镜侧的前端的正前方弯曲(11)45至90度。护套被对齐,以使透镜区域中的光导(8)的轴位于xy平面中,并且光导的轴位于z轴或yz平面中的轴向上偏离从此到45度。

著录项

  • 公开/公告号DE10009145A1

    专利类型

  • 公开/公告日2001-08-23

    原文格式PDF

  • 申请/专利权人 TECHNOLAB GMBH;

    申请/专利号DE2000109145

  • 发明设计人 NUSCHE OLAF;

    申请日2000-02-22

  • 分类号G02B23/24;H05K13/08;G02B23/26;

  • 国家 DE

  • 入库时间 2022-08-22 01:09:54

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