Electronic or micro-electronic component is formed by number of insulation layers on substrate structured for free surfaces to be activated so that seeded by metallizing solution

摘要

To metallize at least one insulation layer in an electronic or micro-electronic component, at least one insulation layer (2) which can be activated is applied to a substrate (1). At least one second insulation layer (3) which can be activated is laid over the first, and is structured. A third insulation layer (4) which cannot be activated is laid over the second, which can be structured. The free activating surfaces are seeded and metallized (5). The layers have a maximum thickness of 50 mu m.