首页> 外国专利> Etching oxide layer on nitride layer, comprises preparing plasma derived from carbonaceous and fluorine-containing gas and gas containing nitrogen, and etching in plasma

Etching oxide layer on nitride layer, comprises preparing plasma derived from carbonaceous and fluorine-containing gas and gas containing nitrogen, and etching in plasma

机译:在氮化物层上蚀刻氧化物层,包括制备由含碳和含氟气体和含氮气体衍生的等离子体,以及在等离子体中进行蚀刻

摘要

Process for etching an oxide layer located on a nitride layer in the upper region of a substrate having a high etching selectivity for the oxide layer comprises preparing a plasma derived from a carbonaceous and fluorine-containing gas and a gas containing nitrogen, and etching the substrate in the plasma.
机译:蚀刻位于对氧化物层具有高蚀刻选择性的衬底的上部区域中的氮化物层上的氧化物层的方法包括:制备由含碳和含氟气体以及含氮气体衍生的等离子体,以及蚀刻衬底在血浆中。

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