Compact semiconductor element comprises a wafer having a chip region, a substrate arranged on the chip region, conducting bodies, a distancing device between the wafer and the substrate and component contacts

摘要

Compact semiconductor element comprises a wafer having a chip region, a substrate arranged on the chip region, conducting bodies, a distancing device between the wafer and the substrate and component contacts. Compact semiconductor element comprises a wafer having a chip region (10) with a dielectric contacting assembly surface (101) provided with several contacting spots (100) for the access to the inner circuits of the chip region; a substrate arranged on the chip region of the wafer and having a switching arrangement lying over the assembly surface; conducting bodies (30) arranged between the assembly surface and the switching arrangement surface to connect contacting spots to soldering points; a distancing device between the wafer and the substrate; and component contacts formed on another surface of the substrate opposite the switching arrangement. An Independent claim is also included for a process for the production of the semiconductor element. Preferred Features: The distancing device has several pins (31) extending between the assembly surface and the switching arrangement to form an intermediate chamber between the wafer and the substrate. The intermediate chamber is filled with an insulating layer.