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CVD-based process for manufacturing stable low-resistivity poly-metal gate electrodes

机译:基于CVD的稳定低电阻多金属栅电极制造工艺

摘要

A process for forming a W-poly gate stack (110) comprising the steps of: (1) deposition of doped polysilicon (112) on a thin dielectric layer (108) covered substrate (102), (2) deposition of WNx by a CVD-based process, (3) thermal treatment to covert WNx into thermally stable barrier, WSiNx, (114) and to remove excess nitrogen and (4) deposition of W layer (116). The stack layers are then etched to form the gate electrode (110).
机译:一种形成W-多晶硅栅叠层( 110 )的工艺,包括以下步骤:(1)在薄介电层(上沉积掺杂的多晶硅( 112 )) > 108 )覆盖的基板( 102 ),(2)通过基于CVD的工艺沉积WNx,(3)热处理以将WNx转换为热稳定的阻挡层WSiNx,(< B> 114 )并除去多余的氮,以及(4)沉积W层( 116 )。然后蚀刻堆叠层以形成栅电极( 110 )。

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