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Article for de-embedding parasitics in integrated circuits

机译:消除集成电路中寄生效应的文章

摘要

An article for de-embedding parasitics and/or acting as an on-wafer calibration standard is disclosed. In particular, some articles in accordance with the present invention provide structures on integrated circuits that mitigate the severity of parasitics Furthermore, some articles in accordance with the present invention are well-suited for use with conductive substrates that operate at high frequencies.;In an illustrative embodiment, conductive elements are used to construct structures near and/or around the leads on the integrated circuit. When the structures are grounded, the structures function to (at least) partially shield the leads to and from the DUT in a manner that is analogous to stripline, microstrip and coaxial cable. Because the electric fields emanating from the leads terminate in the grounded structure and not in the conductive substrate of the integrated circuit, the severity of the parasitics in the leads in mitigated.;An illustrative embodiment of the present invention is an integrated circuit comprising: a first pad, a first lead, a second pad, and a second lead made from a first conductive layer; a substrate; a first plate made from a second conductive layer that is between and electrically insulated from the first lead and the substrate; and a second plate made from the second conductive layer that is between and electrically insulated from the second lead and the substrate.
机译:公开了一种用于去嵌入寄生物和/或充当晶圆上校准标准的物品。特别地,根据本发明的一些制品提供了在集成电路上的结构,其减轻了寄生效应的严重性。此外,根据本发明的一些制品非常适合与在高频下工作的导电基板一起使用。在说明性实施例中,导电元件用于在集成电路上的引线附近和/或周围构造结构。当结构接地时,结构的作用是(至少)以类似于带状线,微带和同轴电缆的方式(至少)部分屏蔽去往DUT的引线。因为从引线发出的电场终止于接地结构而不是集成电路的导电衬底,所以减轻了引线中的寄生效应的严重性。本发明的说明性实施例是一种集成电路,其包括:第一焊盘,第一引线,第二焊盘和由第一导电层制成的第二引线;基材;由第二导电层制成的第一板,该第二导电层在第一引线和基板之间并且与第一引线和基板电绝缘;由第二导电层制成的第二板,该第二板位于第二引线和基板之间并且与第二引线和基板电绝缘。

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