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Methods for forming conductive micro-bumps and recessed contacts for flip-chip technology and method of flip-chip assembly
Methods for forming conductive micro-bumps and recessed contacts for flip-chip technology and method of flip-chip assembly
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机译:用于倒装芯片技术的形成导电微凸块和凹陷触点的方法以及倒装芯片组装的方法
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摘要
A flip-chip semiconductor die assembly is provided with discrete projecting connective elements on the die and mating recessed contacts on the substrate, together forming a plurality of electrical, mechanical, and thermal connections between the die and substrate. The element and recess provide a self-aligning feature. Compared to the prior art, a less costly, simpler method for forming the element and recess is provided, which method requires fewer process steps, uses less raw materials, and generates less waste. The method allows for placement of fine-pitch connective elements and precise control of element size and height.
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