Inspection manner of solder ball loading, survey instrument, and solder ball on-board device null of solder ball

摘要

PURPOSE: To provide a solder ball mounting inspection method and device for mounting solder which is simple in configuration, and inexpensive, and can be simply and easily utilized daily, and a device for mounting a solder ball provided with the inspection means. ;CONSTITUTION: Solder balls 21, 22,... in a row are shot by such image pick-up means 3 as a video camera in a constitution where the solder balls 21, 22,... in a row can be recognized in the form of a line or a surface, when the mounting of the solder balls is inspected in the case when a plurality of solder balls 21, 22,... are mounted in a row on a surface 1 to be mounted with such connection part 11 as a gold pad, etc., for connection using solder. Whether the mounting of the solder balls is proper or not is judged depending on whether a shot image is in a continuous straight line without any cut-out or there is a defective site within a surface.;COPYRIGHT: (C)1996,JPO