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Vacuum arc deposition method, vacuum arc deposition apparatus and rotary cutting tool

机译:真空电弧沉积方法,真空电弧沉积设备和旋转切割工具

摘要

Problem to be solved: to provide a vacuum arc deposition method and apparatus and a rotary cutting tool capable of forming a hard coating excellent in both adhesion to the substrate and surface roughness. The vacuum chamber 1 is provided with a sub chamber 3 which is hard to be evacuated from the film-forming chamber 2, an arc evaporation source 4 is installed in the auxiliary chamber 3, and a gas such as nitrogen gas is introduced into the auxiliary chamber 3 from the gas introducing part 6 during the cleaning of the substrate 10 before the film formation, and the gas pressure in the auxiliary chamber 3 is base When the cathode (evaporation material) of the arc evaporation source 4 is kept higher than the gas pressure around the material 10, and ionized by dissolving the cathode (evaporation material) of the arc evaporation source 4, the generation of the molten particles is suppressed without worsening the sputtering effect, and thus a rotary cutting tool having a small surface roughness can be provided. .
机译:要解决的问题:提供一种真空电弧沉积方法和设备以及一种旋转切割工具,该方法和设备以及旋转切割工具能够形成对基材的粘附性和表面粗糙度均优异的硬质涂层。真空室1设置有难以从成膜室2排出的副室3,在辅助室3内设置有电弧蒸发源4,将氮气等气体导入辅助室3。在成膜前的基板10的清洗过程中,从气体导入部6从气体导入部3进入腔室3,辅助腔室3内的气体压力成为基准,使电弧蒸镀源4的阴极(蒸镀材料)比气体高。通过在材料10周围施加压力,并通过溶解电弧蒸发源4的阴极(蒸发材料)使其离子化,可以抑制熔融颗粒的产生而不会恶化溅射效果,因此可以制造具有较小表面粗糙度的旋转切削工具提供。 。

著录项

  • 公开/公告号JPWO00/56947A1

    专利类型

  • 公开/公告日2002-07-02

    原文格式PDF

  • 申请/专利权人 住友電気工業株式会社;

    申请/专利号JP特願2000-606805(P2000-606805)

  • 申请日2000-03-16

  • 分类号C23C14/32;B23B27/14;B23P15/28;C23C14/06;C23C14/08;

  • 国家 JP

  • 入库时间 2022-08-22 01:02:16

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