Deposition of Ti-AI-N Films by Using a Cathodic Vacuum Arc with Pulsed Bias

摘要

Ti-Al-N hard films have been prepared by cathodic arc deposition by using an unipolar pulsed bias.In the present study,Ti-Al-N films were deposited on stainless steel and silicon wafers.The deposition rate,micrograph,preferred orientation and composition were systematically investigated by usingx-ray diffraction(XRD),energy dispersive X-ray spectroscopy(EDX), and a scanning electron microscope(SEM).It is shown that substate bias duty cycle and frequency have a great effect on film structure.A simple explanation for the results is also presented.