Metal renforcing plate for semiconductor package support, component and these production manners null for metal renforcing plate

摘要

PROBLEM TO BE SOLVED: To prevent a trouble from occurring due to the adhesion of chips to, for example, a mold on cutting even if an adhesive layer is formed also at a site that is opposite to a tie bar of a lead part to be cut off when mounting a semiconductor package. ;SOLUTION: A pilot hole and a metal reinforcing plate part 1 in desired shape are formed on a line material, for example, by punching and etching, an adhesive tape that is cut to a size so that the outer edge is slightly smaller than an outer edge 8 of the metal reinforcing plate and an inner edge 7 is located slightly outside a position that becomes the inner edge of an adhesion part when a semiconductor package is assembled using the metal reinforcing plate is adhered to the surface of the metal reinforcing plate 1, and then it is cut to a desired length, thus obtaining a member for metal enforcing plate. Then, the metal reinforcing plate 1 is cut off the member to obtain the metal reinforcing plate 1 from the member for metal reinforcing plate.;COPYRIGHT: (C)1998,JPO