首页>
外国专利>
It is low dielectricity factor thermosetting metaplasia resin constituent
It is low dielectricity factor thermosetting metaplasia resin constituent
展开▼
机译:低介电常数热固性化生树脂成分
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: To obtain the subject composition low in dielectric dissipation factor and excellent in adhesion, flame retardancy and heat and chemical resistances, comprising a specific cyanate ester compound, etc., a specified phenolic compound and a specific brominated epoxy resin in a specified proportion, and suitable for printed wiring boards, etc. ;CONSTITUTION: This thermosetting resin composition having a low dielectric constant comprises (A) 100 pts.wt. cyanate ester compound expressed by formula I [R1 is a bi- or a polyvalent aromatic residue; the cyanate ester group is directly bonded to R1; (n) is ≥2] such as 1,3-dicyanatobenzene and/or its prepolymer, (B) 100-550 pts.wt. phenolic compound expressed by formula II [(q) and (r) are each an integer of ≥0; (s) is a natural number; X is H or an alkyl] and (C) 250-550 pts.wt. brominated epoxy resin having ≥30wt.% bromine content.;COPYRIGHT: (C)1995,JPO
展开▼