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It is low dielectricity factor thermosetting metaplasia resin constituent

机译:低介电常数热固性化生树脂成分

摘要

PURPOSE: To obtain the subject composition low in dielectric dissipation factor and excellent in adhesion, flame retardancy and heat and chemical resistances, comprising a specific cyanate ester compound, etc., a specified phenolic compound and a specific brominated epoxy resin in a specified proportion, and suitable for printed wiring boards, etc. ;CONSTITUTION: This thermosetting resin composition having a low dielectric constant comprises (A) 100 pts.wt. cyanate ester compound expressed by formula I [R1 is a bi- or a polyvalent aromatic residue; the cyanate ester group is directly bonded to R1; (n) is ≥2] such as 1,3-dicyanatobenzene and/or its prepolymer, (B) 100-550 pts.wt. phenolic compound expressed by formula II [(q) and (r) are each an integer of ≥0; (s) is a natural number; X is H or an alkyl] and (C) 250-550 pts.wt. brominated epoxy resin having ≥30wt.% bromine content.;COPYRIGHT: (C)1995,JPO
机译:目的:为了获得介电耗散率低,粘附性,阻燃性以及耐热性和耐化学性优异的主题组合物,其包含特定比例的特定氰酸酯化合物,特定的酚类化合物和特定的溴化环氧树脂,组成:该介电常数低的热固性树脂组合物的含量为(A)100pts.wt。式I [R 1 ]表示的氰酸酯化合物为二价或多价芳族残基。氰酸酯基直接键合到R 1 上; (n)是≥ 2],例如1,3-二氰基苯和/或其预聚物,(B)100-550pts.wt。由式II [(q)和(r)表示的酚化合物分别为≥ 0的整数; (s)是自然数; X是H或烷基]和(C)250-550pts.wt。溴含量≥30wt%的溴化环氧树脂。版权所有:(C)1995,日本特许厅

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