SURFACE-MODIFIED SILICA FOR EPOXY MOLDING MATERIAL, METHOD FOR PRODUCING THE SAME, APPARATUS THEREFOR AND EPOXY MOLDING MATERIAL FOR SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide surface-modified silica by modifying the surface of silica by a plasma polymerization coating method so as to enhance the adhesive power of the silica as a principal component of an epoxy molding material to an epoxy resin and to provide an epoxy molding material for a semiconductor package utilizing the surface-modified silica, having remarkably improved various physical properties and free of fear of environmental pollution in production processes.;SOLUTION: The surface of silica is coated by a plasma polymerization method with one or more selected from amine compounds, 1,2-epoxy-5-hexene, allyl mercaptan and allyl alcohol. The silica having 25-35 μm average particle diameter is charged into a plasma polymerization reactor, the air pressure in the reactor is lowered by a vacuum pump and one or more selected from amine compounds, 1,2-epoxy-5-hexene, allyl mercaptan and allyl alcohol are made to flow in the reactor and plasma-polymerized.;COPYRIGHT: (C)2002,JPO