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WHISKER-FREE TIN AND TIN ALLOY PLATING SOLUTION, PRINTING FILM AND PLATING OBJECT

机译:无晶须的锡和锡合金镀液,印刷膜和镀液对象

摘要

PROBLEM TO BE SOLVED: To prepare a tin plating solution or tin alloy plating solution which obviates the generation of whiskers even if an object to be plated is not subjected to heat treatment.;SOLUTION: The tin plating solution or tin alloy plating solution contains, as additives, at least one kind selected from the group consisting of a bisphenol A ethylene oxide adduct, bisphenol A propylene oxide adduct, bisphenol F ethylene oxide adduct and bisphenol F propylene oxide adduct. The tin or tin alloy plating film which obviates the generation of the whiskers for ≥1 year is obtained by these additives even if the plating solution is not subjected to the heat treatment.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:即使在不进行热处理的情况下,也要制备能够避免晶须产生的锡镀液或锡合金镀液。溶液:锡镀液或锡合金镀液中含有:作为添加剂,选自双酚A环氧乙烷加合物,双酚A环氧丙烷加合物,双酚F环氧乙烷加合物和双酚F环氧丙烷加合物中的至少一种。即使不对镀液进行热处理,也可通过这些添加剂获得可避免1年以上晶须产生的锡或锡合金镀膜。版权所有:(C)2002,JPO

著录项

  • 公开/公告号JP2002275678A

    专利类型

  • 公开/公告日2002-09-25

    原文格式PDF

  • 申请/专利权人 NIKKO MATERIALS CO LTD;

    申请/专利号JP20010057139

  • 发明设计人 AIBA TAMAHIRO;KUMAGAI MASASHI;

    申请日2001-03-01

  • 分类号C25D3/32;C25D3/60;

  • 国家 JP

  • 入库时间 2022-08-22 00:58:46

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