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LOCALIZED LEVEL MEASURING EQUIPMENT AND METHOD FOR SEMICONDUCTOR WAFER

机译:半导体晶片的局部水平测量设备和方法

摘要

PROBLEM TO BE SOLVED: To provide localized level measuring equipment and method of a semiconductor wafer for accurately measuring the localized level of the desired area of a semiconductor wafer surface by relatively few processes.;SOLUTION: In the state of forming an inversion layer 33 and a depletion layer 35 by electrodes 32 and 34, a current generated by the re-coupling of charges at the localized level existing in the area of the depletion layer 35 flows through the inversion layer 33 between the electrode 36 and the electrode 31e. By measuring the current, the localized level like a boundary trap existing in the area of the depletion layer 35 right below the electrode 34 is measured.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供半导体晶片的局部水平测量设备和方法,以通过相对较少的过程来精确地测量半导体晶片表面的期望区域的局部水平。在通过电极32和34形成耗尽层35时,由在耗尽层35的区域内存在的局部水平的电荷的再耦合而产生的电流流过电极36和电极31e之间的反转层33。通过测量电流,测量了像在电极34正下方的耗尽层35的区域中存在的边界陷阱一样的局部能级。COPYRIGHT:(C)2002,JPO

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