LEAD STRUCTURE OF CIRCUIT BOARD MOUNTING COMPONENT AND STRUCTURE FOR BONDING LEAD OF COMPONENT TO CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a component mounting technology exhibiting proper productivity and bonding strength in which the stock components are decreased, investment in the facility is reduced and the labor required for preparing and manufacturing the component is reduced.;SOLUTION: Each lead of a terminal component (ISM-type terminal component) 6 comprises a surface mounting SM lead part 62 and an insertion mounting IM lead part 61 perpendicular thereto on the same plane, where a pad 72 is formed on the a printed board (for ISM) 7 and a through-hole 71 is made in the region thereof. When the IM lead part 61 is inserted into the through-hole 71, the component can be mounted by both surface mounting and insertion mounting and bonding strength is increased significantly, through solder bonding to both the through-hole 71 and the pad 72.;COPYRIGHT: (C)2002,JPO