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METHOD FOR MANUFACTURING RE-BONDED CHIP PRODUCT FOR VEHICLE AND RE-BONDED CHIP PRODUCT FOR VEHICLE
METHOD FOR MANUFACTURING RE-BONDED CHIP PRODUCT FOR VEHICLE AND RE-BONDED CHIP PRODUCT FOR VEHICLE
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机译:用于车辆的重新粘合的芯片产品的制造方法和用于车辆的重新粘合的芯片产品
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摘要
PROBLEM TO BE SOLVED: To provide a re-bonded chip product for a vehicle such as a lightweight seat cushion having proper hardness or a floor mat having sufficient hardness and excellent in fogging resistance, and the re-bonded chip product. SOLUTION: A mixture of p-MDI and TDI or a prepolymer prepared using a raw material containing 100 mass pts. of p-MDI, 10-50 mass pts., especially 15-40 mass pts. of polyol with a mol.wt. of 1,000-4,000 and a hydroxyl number of 250 or less, especially, 40-120 and 5-40 mass pts. of a plasticizer with a mol.wt. of 395 or more and a boiling point of 340 deg.C or higher or propylene carbonate is used as a binder to manufacture the re-bonded chip product for a vehicle. The viscosity of the polyol at 25 deg.C is preferably 400 mPa s or less and, as the plasticizer used as a diluent, diisononyadipate or the like is preferably used.
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