首页> 外国专利> METHOD FOR MANUFACTURING RE-BONDED CHIP PRODUCT FOR VEHICLE AND RE-BONDED CHIP PRODUCT FOR VEHICLE

METHOD FOR MANUFACTURING RE-BONDED CHIP PRODUCT FOR VEHICLE AND RE-BONDED CHIP PRODUCT FOR VEHICLE

机译:用于车辆的重新粘合的芯片产品的制造方法和用于车辆的重新粘合的芯片产品

摘要

PROBLEM TO BE SOLVED: To provide a re-bonded chip product for a vehicle such as a lightweight seat cushion having proper hardness or a floor mat having sufficient hardness and excellent in fogging resistance, and the re-bonded chip product. SOLUTION: A mixture of p-MDI and TDI or a prepolymer prepared using a raw material containing 100 mass pts. of p-MDI, 10-50 mass pts., especially 15-40 mass pts. of polyol with a mol.wt. of 1,000-4,000 and a hydroxyl number of 250 or less, especially, 40-120 and 5-40 mass pts. of a plasticizer with a mol.wt. of 395 or more and a boiling point of 340 deg.C or higher or propylene carbonate is used as a binder to manufacture the re-bonded chip product for a vehicle. The viscosity of the polyol at 25 deg.C is preferably 400 mPa s or less and, as the plasticizer used as a diluent, diisononyadipate or the like is preferably used.
机译:解决的问题:提供一种用于车辆的重新粘合的芯片产品,例如具有适当硬度的轻质座垫或具有足够的硬度和优异的耐雾性的地板垫,以及重新粘合的芯片产品。解决方案:对-MDI和TDI的混合物或使用包含100质量点的原料制备的预聚物。 p-MDI为10-50质量点,尤其是15-40质量点。摩尔百分数的多元醇分子量为1,000-4,000,羟基数为250或更小,尤其是40-120和5-40质量点。 mol.wt的增塑剂熔点为395或更高,沸点为340℃或更高的碳酸亚丙酯或碳酸亚丙酯用作粘合剂,以制造用于车辆的重新粘合的切片产品。多元醇在25℃下的粘度优选为400mPa·s以下,作为用作稀释剂的增塑剂,优选使用己二酸二异壬酯等。

著录项

  • 公开/公告号JP2002154164A

    专利类型

  • 公开/公告日2002-05-28

    原文格式PDF

  • 申请/专利权人 INOAC CORP;

    申请/专利号JP20000353002

  • 发明设计人 YANO TSUTOMU;

    申请日2000-11-20

  • 分类号B29C67/20;B60R13/02;C08G18/76;C08K5/12;C08K5/1565;C08L75/04;

  • 国家 JP

  • 入库时间 2022-08-22 00:55:54

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