首页> 外国专利> METHOD FOR MANUFACTURING RE-BONDED PRODUCT AND DEVICE FOR MANUFACTURING RE-BONDED PRODUCT USED FOR IT

METHOD FOR MANUFACTURING RE-BONDED PRODUCT AND DEVICE FOR MANUFACTURING RE-BONDED PRODUCT USED FOR IT

机译:制造再结合产品的方法和用于再结合产品的制造设备

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a re-bonded product which prevents the surface of the product from being wet and does not require a drying process, and a device for manufacturing the re-bonded product used for it.;SOLUTION: The method for manufacturing the re-bonded product comprises the steps of filling a re-bonded raw material containing a chip mixture (rubber chips and wood chips or the like), resin chips (polyurethane foam chips or the like) and a moisture curing type adhesive (a one liquid type polyurethane adhesive or the like) into a molding die and then supplying superheated steam (It is preferable to have the temperature of 130-200°C) in the molding die to bring the re-bonded raw material and the superheated stem into contact with each other so that the adhesive is hardened. The space between the chips in the chip mixture is joined. The device for manufacturing the re-bonded product is provided with a water supply source 1, a steam generator 2, a superheated steam generator 3, the molding die 4, and a means 7 for switching a superheated steam flow path or the like. The device has circulating piping 65 or the like for circulating the superheated steam to the superheated steam generator.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种用于制造重新粘合的产品的方法,该方法可防止产品表面变湿并且不需要干燥过程,以及一种用于制造该产品的重新粘合的产品的装置。 :制造再粘合产品的方法包括以下步骤:填充包含木屑混合物(橡胶屑和木屑等),树脂屑(聚氨酯泡沫屑等)的再粘合的原材料和湿固化型粘合剂(一种液体型聚氨酯粘合剂等)注入成型模,然后在成型模中供应过热蒸汽(优选温度为130-20°C),以使重新粘合的原料和过热的阀杆彼此接触,从而使粘合剂硬化。芯片混合物中的芯片之间的空间被连接在一起。用于制造再粘合产品的设备包括:供水源1,蒸汽发生器2,过热蒸汽发生器3,成型模具4以及用于切换过热蒸汽流路等的装置7。该装置具有用于使过热蒸汽循环至过热蒸汽发生器的循环管道65等。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005074917A

    专利类型

  • 公开/公告日2005-03-24

    原文格式PDF

  • 申请/专利权人 INOAC CORP;

    申请/专利号JP20030310650

  • 发明设计人 MADOKORO MUTSUO;

    申请日2003-09-02

  • 分类号B29C43/02;

  • 国家 JP

  • 入库时间 2022-08-21 22:33:03

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