首页> 外国专利> METHOD FOR MANUFACTURING SUBSTRATE FOR ELECTRON BY METHOD WHEREIN TWO-LAYER OR THREE-LAYER STRUCTURED ELECTRICITY-CONDUCTING BODIES ARE VERTICALLY ARRAYED AT SUITABLE POSITIONS IN CONTAINER OF SUITABLE SHAPE AND SIZE, FIRE RETARDANT, HEAT RESISTING AND INSULATION RESISTING NATURALLY SETTING RESIN, FIRE RETARDANT, HEAT RESISTING AND HEAT INSULATION RESISTING THERMOPLASTIC RESIN, OR MIXTURE WHEREIN EACH AND FILLER (SiO2, ALO2, ZrO2 AND THE LIKE) ARE BLENDED IN SUITABLE RATIO IS HEATED TO SUITABLE TEMPERATURE, CAST INTO THE CONTAINER (MOLD) AND CURED BY COOLING OR THE LIKE

METHOD FOR MANUFACTURING SUBSTRATE FOR ELECTRON BY METHOD WHEREIN TWO-LAYER OR THREE-LAYER STRUCTURED ELECTRICITY-CONDUCTING BODIES ARE VERTICALLY ARRAYED AT SUITABLE POSITIONS IN CONTAINER OF SUITABLE SHAPE AND SIZE, FIRE RETARDANT, HEAT RESISTING AND INSULATION RESISTING NATURALLY SETTING RESIN, FIRE RETARDANT, HEAT RESISTING AND HEAT INSULATION RESISTING THERMOPLASTIC RESIN, OR MIXTURE WHEREIN EACH AND FILLER (SiO2, ALO2, ZrO2 AND THE LIKE) ARE BLENDED IN SUITABLE RATIO IS HEATED TO SUITABLE TEMPERATURE, CAST INTO THE CONTAINER (MOLD) AND CURED BY COOLING OR THE LIKE

机译:在两层或三层结构的导电体垂直放置在合适的位置并保持合适的形状和尺寸,阻燃性,耐热性,绝缘性和绝缘性的方法中,制造电子基体的方法采用两层或三层结构的导电体耐热和隔热的热塑树脂,或混合了每种和填充物(SiO2,ALO2,ZrO2和类似物)的混合物,将合适的比例加热到合适的温度,并渗入到容器(模子)或模子中

摘要

PROBLEM TO BE SOLVED: To technically solve a necessity wherein for a substrate for electron a very thin good conductive wire is vertically buried or filled by passing through the substrate at accurate positions in a minimum pitch.;SOLUTION: Two layer or three layer structured electricity-conducting bodies are vertically arrayed at suitable positions in a container (mold) of a suitable shape and size. A fire retardant, heat resisting and insulation resisting naturally setting resin, a fire retardant, heating resisting and insulation resisting heat insulation resisting thermoplastic resin, or a mixture wherein each and a filler (SiO2, AlO2, ZrO2 and the like) are blended in a suitable ratio, is heated at a suitable temperature, cast into a container (mold), and cured by cooling.;COPYRIGHT: (C)2001,JPO
机译:要解决的问题:从技术上解决这样的必要性:对于电子基板,通过以最小间距在准确的位置穿过基板垂直地埋入或填充非常细的良导线;解决方案:两层或三层结构的电-导电体在适当形状和大小的容器(模具)中的适当位置处垂直排列。阻燃,耐热和隔热的天然固化树脂,阻燃,耐热和隔热的隔热热塑性树脂,或其中每种与填料(SiO2,AlO2,ZrO2等)混合的混合物适当的比例,在适当的温度下加热,倒入一个容器(模具)中,并通过冷却使其固化。;版权所有:(C)2001,日本特许厅

著录项

  • 公开/公告号JP2001322135A

    专利类型

  • 公开/公告日2001-11-20

    原文格式PDF

  • 申请/专利权人 KOJIMA HIROYUKI;

    申请/专利号JP20000183750

  • 发明设计人 KOJIMA SHINICHIRO;

    申请日2000-05-15

  • 分类号B29C39/10;C08K3/22;C08K3/36;C08L101/00;H05K3/00;H05K3/40;

  • 国家 JP

  • 入库时间 2022-08-22 00:55:00

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