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APPARATUS AND METHOD FOR OPTICALLY PROCESSING PLANAR PART OF NOTCH-BEVELED PART OF SEMICONDUCTOR WAFER
APPARATUS AND METHOD FOR OPTICALLY PROCESSING PLANAR PART OF NOTCH-BEVELED PART OF SEMICONDUCTOR WAFER
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机译:光学处理半导体晶片的切角倒角部分的平面部分的装置和方法
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摘要
PROBLEM TO BE SOLVED: To provide an apparatus and a method for optical processing, which exclude extra equipment and can speedily and accurately detect a small and local planar part of a V-notch internal surface of a semiconductor wafer, with a simple constitution and also automatically put an optical system of an optical processing part in focus.;SOLUTION: This optical processor is equipped with a focusing mechanism, and the optical processing part (20) is supported by a processing part support means, so that the optical axis of laser light for focusing is previously made orthogonal to the small planar part (12b); and the semiconductor wafer (W) and optical processing part (20) are relatively moved by a moving means (2), almost along the border area between the peripheral edge beveled part of the semiconductor wafer (W); and one of the top and reverse surfaces of the wafer and the laser light for automatic focusing is driven by a laser light drive means. A detection means detects variations in the quantity of return light of the laser light for automatic focusing and a determining means determines that the area, when the light quantity variation momentarily increases is the beveled part planar part of the V notch.;COPYRIGHT: (C)2002,JPO
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