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APPARATUS AND METHOD FOR OPTICALLY PROCESSING PLANAR PART OF NOTCH-BEVELED PART OF SEMICONDUCTOR WAFER

机译:光学处理半导体晶片的切角倒角部分的平面部分的装置和方法

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and a method for optical processing, which exclude extra equipment and can speedily and accurately detect a small and local planar part of a V-notch internal surface of a semiconductor wafer, with a simple constitution and also automatically put an optical system of an optical processing part in focus.;SOLUTION: This optical processor is equipped with a focusing mechanism, and the optical processing part (20) is supported by a processing part support means, so that the optical axis of laser light for focusing is previously made orthogonal to the small planar part (12b); and the semiconductor wafer (W) and optical processing part (20) are relatively moved by a moving means (2), almost along the border area between the peripheral edge beveled part of the semiconductor wafer (W); and one of the top and reverse surfaces of the wafer and the laser light for automatic focusing is driven by a laser light drive means. A detection means detects variations in the quantity of return light of the laser light for automatic focusing and a determining means determines that the area, when the light quantity variation momentarily increases is the beveled part planar part of the V notch.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供一种用于光学处理的设备和方法,其不包括额外的设备,并且能够以简单的结构并且还可以快速且准确地检测半导体晶片的V形缺口内表面的局部小平面部分。解决方案:该光学处理器配备有聚焦机构,并且光学处理部件(20)由处理部件支撑装置支撑,从而使激光的光轴自动聚焦。用于聚焦的光事先与小平面部分(12b)正交。半导体晶片(W)和光学处理部件(20)通过移动装置(2)几乎沿着半导体晶片(W)的周缘斜面部分之间的边界区域相对移动。晶片的顶面和反面之一以及用于自动聚焦的激光由激光驱动装置驱动。检测装置检测用于自动聚焦的激光的返回光量的变化,并且确定装置确定当光量变化瞬时增加时该区域是V槽的斜面平面部分。日本特许厅

著录项

  • 公开/公告号JP2002093692A

    专利类型

  • 公开/公告日2002-03-29

    原文格式PDF

  • 申请/专利权人 KOMATSU LTD;

    申请/专利号JP20000284617

  • 发明设计人 SATO ETSURO;

    申请日2000-09-20

  • 分类号H01L21/027;H01L21/02;H01L21/68;

  • 国家 JP

  • 入库时间 2022-08-22 00:54:59

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