WEDGE JUNCTION RELIABILITY EVALUATING APPARATUS AND EVALUATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a test apparatus and method which can evaluate the characteristics of a wedge junction of bonding wire for semiconductors. SOLUTION: In a testing using this method and apparatus for evaluating the strength of a wedge junction, a tensile load is applied to the wedge junction of a semiconductor bonding wire, the bonding wire is pulled, while keeping constant the angle between a tensile direction and a junction sample surface to measure the characteristics of the changes in the wire.