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SYSTEM AND METHOD FOR FINDING OUT DEFECTIVE DEVICE IN SEMICONDUCTOR MANUFACTURING FACILITY

机译:找出半导体制造设备中的缺陷设备的系统和方法

摘要

PROBLEM TO BE SOLVED: To provide a system and method for finding out defective devices (tools) in a semiconductor manufacturing facility which produces a semiconductor wafer.;SOLUTION: A data base containing data indicating the passing time of each wafer through each of a plurality of devices is prepared and whether or not each wafer has a certain kind of damage mark is discriminated by testing the wafers. The lot list of each device is prepared so that the arranging order of lot continuation in the list may indicate the process sequence of lots and a weight value is designated to each lot in the list, in such a way that a predetermined positive weight value is designated to the lot of a wafer having the damage mark and a negative weight value is designated to the lot of a wafer having no damage mark. A cumulative value is generated by continuously adding the weight value of each lot list corresponding to each device to each other, and the maximum cumulative value of each device is obtained by designating the maximum peak cumulative value to each device in the course of adding the weight values to each other.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供一种用于在生产半导体晶片的半导体制造设施中找出有缺陷的装置(工具)的系统和方法。解决方案:数据库包含指示每个晶片通过多个晶片中的每个晶片的通过时间的数据准备好设备清单,并通过测试晶圆来区分每个晶圆是否具有某种损坏标记。准备每个设备的批次清单,以使清单中批次连续的排列顺序可以指示批次的处理顺序,并以预定的正权重值为标记为具有损伤标记的晶片的批次,并且负负值被指定为没有损伤标记的晶片的批次。通过连续地将与每个设备相对应的每个批号列表的权重值彼此相加来产生累积值,并且通过在相加权重的过程中为每个设备指定最大峰值累积值来获得每个设备的最大累积值互为价值;版权所有:(C)2002,日本特许厅

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