首页> 外国专利> Semiconductor integrated circuit device effectively decreased in surface state regardless of non-permeable layer for chemical species against surface state and process for fabricating thereof

Semiconductor integrated circuit device effectively decreased in surface state regardless of non-permeable layer for chemical species against surface state and process for fabricating thereof

机译:不管用于表面形态的化学物质的非渗透层如何,半导体集成电路器件的表面状态均有效降低,其制造方法

摘要

A cell plate electrode is shared between storage capacitors of memory cells incorporated in a semiconductor dynamic random access memory device of the type having the storage capacitors over bit lines, and slits are formed in the cell plate electrode in such a manner that the boundaries between channel regions and gate oxide layers are horizontally spaced from the outer periphery of the cell plate electrode and the slits by distances equal to or less than a critical distance determined on the basis of a diffusion length of hydrogen in an inter-level insulating layer, thereby causing the hydrogen to surely reach the boundaries for reducing the density of surface state.
机译:在结合在位线上具有存储电容器的类型的半导体动态随机存取存储装置中的存储单元的存储电容器之间共享单元板电极,并且以使得沟道之间的边界的方式在单元板电极中形成狭缝。区域和栅氧化层与单元板电极和狭缝的外周水平地间隔等于或小于基于层间绝缘层中的氢的扩散长度确定的临界距离的距离,从而导致氢必定会到达边界以降低表面态密度。

著录项

  • 公开/公告号US2002047211A1

    专利类型

  • 公开/公告日2002-04-25

    原文格式PDF

  • 申请/专利权人 NEC CORPORATION;

    申请/专利号US20010988787

  • 发明设计人 MITSUMA OOISHI;

    申请日2001-11-20

  • 分类号H01L23/52;

  • 国家 US

  • 入库时间 2022-08-22 00:51:53

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