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Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
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机译:化学方法铜层互连的种子层沉积,修复和制造
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摘要
Electroless deposition of Cu provides for repair of copper seed layers formed by vacuum deposition processes, for formation of copper seed layers on catalytic materials, and for bulk fill of damascene trenches and via openings. Electroless plating baths for such depositions are formulated for both room temperature and elevated temperature operation, and each include a copper source, an environmentally friendly reducing agent, a pH buffer, a complexing agent, and a surfactant.
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