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Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices
Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices
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机译:嵌入式结构可提供用于通孔和接口层对准以及多层器件中导电接口电完整性的电气测试
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摘要
Multilayer substrates, are fabricated with the incorporation therein of non-destructive test structures utilized to provide visual and electrical test data to facilitate the ascertainment and assessment of potential electrical interface failures. Furthermore, there are provided embedded structures in multilayer substrates, such as are employed in chip carrier packaging, so as to facilitate electrical testing for via to via alignment and interface layer alignment, and to enable the testing of conductive interface electrical integrity of multilayer electrical devices.
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