首页> 外国专利> Method for manufacturing an MDL semiconductor device including a DRAM device having self-aligned contact hole and a logic device having dual gate structure

Method for manufacturing an MDL semiconductor device including a DRAM device having self-aligned contact hole and a logic device having dual gate structure

机译:用于制造MDL半导体器件的方法,该MDL半导体器件包括具有自对准接触孔的DRAM器件和具有双栅极结构的逻辑器件

摘要

A method for manufacturing an MDL semiconductor device comprises forming a gate insulating layer and a gate conductive layer in a DRAM device region and a logic device region to provide gate conductive layer patterns which will be respectively formed in the DRAM device region and the logic device region. Next, the gate conductive layer of the logic device region is patterned, and a gate conductive layer pattern is formed only in the logic device region. Spacers are formed on the gate conductive layer patterns, and impurity ions of different conductivity types are twice injected by a process for forming a mask layer pattern and an ion injection process. The first ion injection is performed on one gate conductive layer pattern of the logic device region, and the second ion injection is performed on the gate conductive layer of the DRAM device region and the other gate conductive layer pattern of the logic device region. Next, a patterning process is performed on the DRAM device region for forming gate conductive layer stacks, and self-aligned contact pads are formed.
机译:一种用于制造MDL半导体器件的方法,包括在DRAM器件区域和逻辑器件区域中形成栅极绝缘层和栅极导电层,以提供将分别形成在DRAM器件区域和逻辑器件区域中的栅极导电层图案。 。接下来,对逻辑器件区域的栅极导电层进行构图,并且仅在逻辑器件区域中形成栅极导电层图案。在栅极导电层图案上形成间隔物,并且通过用于形成掩模层图案的工艺和离子注入工艺两次注入不同导电类型的杂质离子。在逻辑器件区域的一个栅极导电层图案上执行第一离子注入,并且在DRAM器件区域的栅极导电层图案上和逻辑器件区域的另一个栅极导电层图案上执行第二离子注入。接下来,在DRAM器件区域上执行构图工艺以形成栅极导电层堆叠,并且形成自对准的接触焊盘。

著录项

  • 公开/公告号US6391704B1

    专利类型

  • 公开/公告日2002-05-21

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号US20010933356

  • 发明设计人 HYUNG-MOO PARK;SUK-GU HONG;

    申请日2001-08-20

  • 分类号H01L218/242;

  • 国家 US

  • 入库时间 2022-08-22 00:49:10

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