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Method for manufacturing semiconductor chips using protecting pricing and separating sheets
Method for manufacturing semiconductor chips using protecting pricing and separating sheets
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机译:利用保护价格和分离片制造半导体芯片的方法
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摘要
The reverse of a wafer is processed after adhering a protecting sheet and a reinforcing plate to the obverse of a wafer. The wafer is mounted on a frame for dicing via a dicing sheet and diced. Then, the protecting sheet is separated from the wafer after irradiating the wafer with ultraviolet light.
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