首页> 外国专利> Method of producing doped polysilicon layers and polysilicon layered structrues and method of structuring layers and layered structures which comprise polysilicon layers

Method of producing doped polysilicon layers and polysilicon layered structrues and method of structuring layers and layered structures which comprise polysilicon layers

机译:制备掺杂的多晶硅层和多晶硅层结构的方法以及构造包括多晶硅层的层和层状结构的方法

摘要

Doped polysilicon layers and layered polysilicon structures are produced, and the layers and layered structures are structured. The doping is distinguished by the fact that the doping compound is added as a process gas during the chemical vapor deposition of the polysilicon to define the doping profile. The feed of dopant to the process gas is stopped toward the end of the vapor deposition, with the result that a boundary layer of undoped silicon is deposited. As a result, a favorable surface quality and better adhesion to a neighboring layer is obtained. The structuring process comprises an at least three-step etching process in which a fluorine containing gas is used for etching in a first step, a chlorine-containing gas is used for etching in a second step and a bromine-containing gas is used for etching in a third step. The invention also encompasses wafers and semiconductor chips produced with the novel doping and/or structuring method.
机译:产生掺杂的多晶硅层和层状多晶硅结构,并构造层和层状结构。掺杂的特征在于,在多晶硅的化学气相沉积过程中添加掺杂化合物作为工艺气体以限定掺杂分布。在气相沉积快要结束时,停止向工艺气体中添加掺杂剂,结果是沉积了未掺杂硅的边界层。结果,获得了良好的表面质量和对相邻层的更好的粘附性。结构化过程包括至少三步蚀刻过程,其中第一步中使用含氟气体进行蚀刻,第二步中使用含氯气体进行蚀刻,蚀刻时使用含溴气体第三步。本发明还包括用新颖的掺杂和/或结构化方法生产的晶片和半导体芯片。

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