首页> 外国专利> METHOD OF PRODUCING DOPED POLYSILICON LAYERS AND POLYSILICON LAYERED STRUCTURES AND METHOD OF STRUCTURIZING LAYERS AND LAYERED STRUCTURES WHICH COMPRISE POLYSILICON LAYERS

METHOD OF PRODUCING DOPED POLYSILICON LAYERS AND POLYSILICON LAYERED STRUCTURES AND METHOD OF STRUCTURIZING LAYERS AND LAYERED STRUCTURES WHICH COMPRISE POLYSILICON LAYERS

机译:制备掺杂的多晶硅层和多晶硅层状结构的方法以及构造包括多晶硅层的层和层状结构的方法

摘要

In the production of a doped polysilicon layer and of layer structures containing such a layer, in which a doping compound is added to the process gas during CVD, the doping compound addition is terminated after achieving the desired doping and the desired deposition duration so that a boundary layer of undoped silicon layer is deposited. Preferably, the doping compound is a gaseous or volatile compound of B, Ga, In, P, As or Sb, especially diborane, trimethylboron, phosphine or arsine. Also claimed is a method of structuring a layer structure having a metal or metal silicide layer on a polysilicon layer by a three stage etching process using a fluorine-containing gas (preferably NF3, SiF4, SF6 and/or fluorinated hydrocarbon) in the first stage, a chlorine-containing gas (preferably HCl, Cl2 and/or BCl3) in the second stage and a bromine-containing gas (preferably HBr) in the third stage. Further claimed is a wafer or semiconductor chip produced using one or both of the above processes.
机译:在制造掺杂的多晶硅层和包含这种层的层结构的过程中,其中在CVD期间将掺杂化合物添加到工艺气体中,在达到所需的掺杂和所需的沉积持续时间之后终止掺杂化合物的添加,因此沉积未掺杂的硅层的边界层。优选地,掺杂化合物是B,Ga,In,P,As或Sb的气态或挥发性化合物,尤其是乙硼烷,三甲基硼,膦或a。还要求保护一种方法,该方法在第一阶段中通过三阶段蚀刻工艺在多晶硅层上构造具有金属或金属硅化物层的层结构,所述三阶段蚀刻工艺使用含氟气体(优选NF3,SiF4,SF6和/或氟化烃)来进行。第二阶段是含氯气体(最好是HCl,Cl2和/或BCl3),第三阶段是含溴气体(最好是HBr)。进一步要求保护的是使用上述方法中的一个或两个制造的晶片或半导体芯片。

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