Monolithic integrated circuit incorporating an inductive component and process for fabricating such an integrated circuit

摘要

A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising:;a semiconductor substrate layer (2);;a passivation layer (4) covering the substrate layer (2);;metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4);;which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).