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Microstructure producing method capable of controlling growth position of minute particle or thin and semiconductor device employing the microstructure
Microstructure producing method capable of controlling growth position of minute particle or thin and semiconductor device employing the microstructure
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机译:能够控制微小粒子或薄层的生长位置的微结构制造方法以及使用该微结构的半导体器件
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摘要
There is provided a microstructure producing method capable of achieving satisfactory uniformity and reproducibility of the growth position, size and density of a minute particle or thin line and materializing a semiconductor device which can reduce the cost through simple processes without using any special microfabrication technique and has superior characteristics appropriate for mass-production with high yield and high productivity as well as a semiconductor device employing the microstructure. An oxide film 12 having a region 12a of a great film thickness and a region 12b of a small film thickness are formed on the surface of a semiconductor substrate 11. Next, a microstructure that is a thin line 15 made of silicon Si is selectively formed only on the surface of the small-film-thickness region 12b of the oxide film 12. 展开▼