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MONITORING OF FILM CHARACTERISTICS DURING PLASMA-BASED SEMICONDUCTOR PROCESSING USING OPTICAL EMISSION SPECTROSCOPY

机译:利用光发射光谱法监测基于等离子体的半导体加工过程中的薄膜特性

摘要

A method and system to monitor characteristics of films by sensing the spectral emissions of a plasma to which the films are exposed. As a result, the method includes sensing optical energy produced by the plasma. The optical energy has a plurality of spectral bands associated therewith, a subset of which is identified as including information corresponding to the film characteristics. The film characteristics are then measured as a function of this information. To increase the accuracy of the measurements, in one embodiment of the present invention a subgroup of the plurality of spectral bands is observed that has data associated that is substantially independent of the characteristics of interest. The characteristics are then measured as a function of both the information and the data.
机译:一种通过感测薄膜所暴露的等离子体的光谱发射来监视薄膜特性的方法和系统。结果,该方法包括感测由等离子体产生的光能。光能具有与其相关的多个光谱带,其子集被识别为包括与膜特性相对应的信息。然后根据该信息测量薄膜特性。为了提高测量的准确性,在本发明的一个实施例中,观察到多个光谱带的子组,该子组具有基本上与所关注的特性无关的关联数据。然后根据信息和数据对特征进行测量。

著录项

  • 公开/公告号WO0239097A2

    专利类型

  • 公开/公告日2002-05-16

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号WO2001US48227

  • 发明设计人 SARFATY MOSHE;OLUSEYI HAKEEM;

    申请日2001-10-30

  • 分类号G01N21/71;

  • 国家 WO

  • 入库时间 2022-08-22 00:36:28

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