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RESIN COMPOUND FOR FORMING INTERLAYER INSULATING LAYER OF PRINTED WIRING BOARD, RESIN SHEET AND COPPER FOIL WITH RESIN FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM
RESIN COMPOUND FOR FORMING INTERLAYER INSULATING LAYER OF PRINTED WIRING BOARD, RESIN SHEET AND COPPER FOIL WITH RESIN FOR FORMING INSULATING LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM
A resin compound for forming an interlayer insulating layer of a printed wiring board, characterized in that it comprises an epoxy resin containing as an epoxy resin curing agent having a nitrogen content of 5 to 25 wt % and a maleimide compound being curable with heat and contains no halogen elements. The resin compound can be used for producing a copper foil with a resin which is free of a halogen element and has high flame retardancy, and further exhibits excellent resistance to water and heat and good strength against peeling between the copper foil and a substrate.
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