RADIO FREQUENCY CIRCUIT MODULE ON MULTI-LAYER SUBSTRATE

摘要

It is an object of the present invention to provide a high-frequency integrated circuit module that is less influenced by electromagnetic waves and does not deteriorate electrical connection. A high frequency circuit module of the present invention having circuit elements mounted on a multilayer circuit board having dielectric layers is provided with exposed interconnects by removing a portion of the dielectric and the strips connected to the circuit elements at the bottom of the exposed connections And a coaxial line for transmitting a high frequency signal to / from the line and the strip line are connected so as to be three-dimensionally straight.