Epoxy punch of trimming process and thimming method thereof in semiconductor packaging

摘要

PURPOSE: An epoxy punch in a trimming process of a semiconductor package is provided to control a crack on a semiconductor package body and to effectively remove a flash on a side surface of a lead, by forming a protrusion in a punch tip of the epoxy punch to eliminate a residual epoxy molding compound(EMC). CONSTITUTION: An epoxy punch base for removing the residual EMC(122) is formed between the semiconductor package body(120) composed of EMC and a damber line of a lead frame. A punch tip eliminates the residual EMC, formed in the lowermost portion of the epoxy punch base. The punch tip and an epoxy die(136) corresponding to the epoxy punch base constitutes a pair. A protrusion unit prevents a crack generated in the semiconductor package body when the residual EMC is removed, formed in the epoxy punch tip.