metal frame for clipping substrate in fabrication -BGA package

摘要

PURPOSE: A metal frame for fixing a PCB(Printed Circuit Board) for fabricating a micro-BGA(Ball Grid Array) package is provided to easily perform a recycle and to reduce costs by fixing the micro-BGA package to the metal frame using a clipping method. CONSTITUTION: A metal frame comprises a window(W) in a center portion, a base plate(5) including position decision pins(500) formed around the window(W), clipping plates(6) having position decision grooves(600) respectively formed on both sides of the window(W), a fixing pin(10) connected to the center portion of one end of the base plate(5), a center road(9) installed to circulate using the fixing pin(10) as a center shaft, a left, and a right connection roads(8a,8b) respectively hinge-connected to the clipping plates(6).